Industrial
GPU Burn-In Series Products
Product Introduction:
This product focuses on the full lifecycle reliability testing needs of GPU chips and modules. Targeting the product characteristics and operating conditions of consumer, industrial, automotive, and server-grade GPUs, it delivers a professional, fully dimensional, highly adaptable, and high-compute-power burn-in test solution.
It covers core test scenarios like high-temperature operating life, high/low temperature power cycling, dynamic electrical stress, and high-load continuous burn-in. It accurately simulates GPU operation under high-compute tasks, prolonged full-load operation, and extreme temperature/humidity environments, enabling precise capture and analysis of failure data.
It provides high-precision, high-stability reliability test support for all stages—GPU chip design, wafer fabrication, packaging & testing, and system integration—ensuring stable GPU operation in eSports, AI, cloud computing, autonomous driving, industrial simulation, and more.
Technical Specs & Core Performance:
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Technical Specifications |
Configuration |
Single chamber: 34 slots; |
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Tray Spacing |
45mm |
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Automation Options |
Automatic test board insertion / extraction mechanism; Automatic door opener (optional) |
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Performance Parameters |
TemperatureRange (°C) |
-10℃~150℃；-40℃~150℃；-70℃~150℃（Optional） |
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Temperature Uniformity (°C) |
±1°C (Empty); ±3°C (Loaded) |
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Power Capacity (kW) |
6.5kw |
Core Advantages
1. Full Scenario Operating Condition Simulation: Covers full-load, high/low temperature cycling, voltage fluctuation, humidity stress, and more. Supports customizable load curves to accurately replicate actual GPU operation in different scenarios, comprehensively verifying reliability.
2. High Power & High Adaptability: Supports single-card power levels from low to ultra-high. Optional water-cooling/air-cooling modes meet different GPU power needs (consumer to server-grade). Provides high-precision, low-ripple power supply to prevent device damage during testing.
3. High-Precision Data Acquisition: Equipped with 1pA-level current sampling and ±0.1mV-level voltage sampling modules. Monitors core parameters (temperature, power, current) in real-time. Supports capture of 50-100 failure data points, providing complete data support for failure analysis.
4. High Compatibility Design: Adapts to various GPU package types (BGA, COB, etc.). Supports testing of single chips, boards, modules, and wafers. Allows customized test fixtures and burn-in boards compatible with different manufacturers and GPU models.
5. Intelligent & Efficient Testing: Multi-channel independent temperature control and operation. Supports unattended automated testing with automatic alarm and test interruption for abnormal conditions. Features an industrial-grade control system and customizable test flows, significantly improving R&D and production line test efficiency.
Typical Applications:
1. Widely used by GPU design houses, wafer fabs, OSATs, system integrators, and third-party testing labs.
2. Covers the entire chain: reliability verification during GPU R&D, yield screening during wafer fabrication, in-process quality control during packaging & testing, and finished product burn-in for system integration.
3. Suitable for testing GPU products used in eSports hardware, AI, cloud computing, autonomous driving, industrial simulation, supercomputing centers, and more.
Quality Commitment:
1. Core components undergo rigorous screening and burn-in testing. Complete system calibration and trial verification are performed before shipment.
2. Customized solution design, installation & commissioning, and professional operation training are provided.
3. Faulty parts are replaced free of charge during the warranty period. Lifetime technical upgrades and support are offered post-warranty.